The global moulded underfill material market was worth approximately USD 7.98 billion in 2022 and is expected to increase to approximately USD 12.25 billion by 2030, with a compound annual growth rate (CAGR) of approximately 5.50% between 2023 and 2030.
The study examines the global moulded underfill material market drivers, restraints/challenges, and their impact on demand during the forecast period. Furthermore, the report investigates new potential in the moulded underfill material business.
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The Market for Moulded Underfill Materials
When it comes to protecting and reinforcing the connections between printed circuit boards (PCBs) and integrated circuits (ICs), the semiconductor industry relies heavily on a type of encapsulant known as moulded underfill material (MUF). After the IC has been mounted to the PCB, this resin-based material is injected into the space between the two. A stiff protective layer is formed once the curing process is complete, encasing the integrated circuit in a solid shield.
Since the protective covering is initially moulded in a certain shape before application, this process is known as moulded underfill (MUF). The form is settled upon after careful consideration of the dimensions of the IC and its surrounding PCB components. The manufacturing and distribution of moulded underfill material for use in the semiconductor industry is the focus of the moulded underfill material market. The demand is anticipated to be driven by a number of positive factors during the forecast period.
Key Takeaways:
• Our research analyst has revealed that, between 2023 and 2030, the worldwide market for moulded underfill materials is expected to expand at a compound annual growth rate (CAGR) of roughly 5.50 percent.
• The global market for moulded underfill materials is expected to grow from its 2022 valuation of USD 7.98 billion to reach USD 12.25 billion by 2030.
• As the semiconductor industry expands, the demand for moulded underfill materials is expected to rise sharply.
The semiconductor industry’s expansion will be a key driver of economic expansion.
As the global semiconductor industry continues to expand, the demand for moulded underfill materials is expected to rise. Consumption of electronic devices, which have grown ubiquitous in today’s technological society, is a major factor in the high rate. As the semiconductor industry continues to soar, companies in the electronic devices sector are increasing their financial and non-financial investments in the introduction of new technologies, which may increase the demand for effective moulded underfill material. As MUF-related technology develops, it has the potential to bring in more money.
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The high price of making MUF will slow the industry’s expansion.
The high cost of producing and using moulded underfill materials is expected to present some growth hurdles for the worldwide moulded underfill material business. These encapsulation units are made from exotic substances that necessitate cutting-edge manufacturing methods. Expert and trained specialists’ support is required as well. Also, the raw materials utilised to make MUF should be of the highest possible grade. The cumulative effect of these factors on the component’s price is a significant growth constraint because it may lead businesses to seek out less expensive alternatives.
Increasing IoT use will lead to expansion possibilities.
As more and more people embrace the concept of Internet connectivity for their everyday appliances and gadgets, new opportunities will arise in the global moulded underfill material market. This facilitates their ability to interact and share information. The sensors, software, and connection built into IoT-operating gadgets are what make the system work. Thermostats, security cameras, and lighting systems, together with wearable fitness trackers, connected automobiles, and industrial machinery, are all examples of common IoT-powered gadgets.
Challenges to market expansion due to associated technical complexity
Using MUF calls for a highly specialised injection moulding process that is notoriously difficult to implement. It requires the assistance of a professional and the usage of specialised equipment to accomplish. As a result, these factors may provide obstacles to the growth of the global moulded underfill material business. Another barrier to MUF’s market growth is the rising uncertainty about whether or not it is compatible with all IC and PCB designs.
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The Global Molded Underfill Material Market is segmented based on product, application and region.
Global Molded Underfill Material Market: Product Segment Analysis
● Thermal Mechanical Analyzer Technology
● Dynamic Mechanical Analyzer Technology
Global Molded Underfill Material Market: Application Segment Analysis
● Flip Chips
● Ball Grid Array
● Chip Scale Packaging
Recent Changes:
• Weltrend Semiconductor Inc, a supplier of adapter USB Power Delivery (PD) Controller Integrated Circuits (ICs), and industry leader Transphorm Inc, a provider of high-performance and highly reliable gallium nitride (GaN) power conversion solutions, announced their alliance in March 2023. A GaN System-in-Package (SiP) was introduced by the firms in a coordinated effort. When compared to similar ICs, the new one is 93% more efficient in terms of power consumption.
• The Dutch semiconductor firm NXP Semiconductors announced in January 2023 that it would open a brand-new, state-of-the-art facilities research and development centre in Bengaluru, India. The Indian government is actively promoting its semiconductor industry.
The global molded underfill material market is led by players like:
● Henkel AG & Co. KGaA
● NAMICS Corporation
● Won Chemical Co. Ltd.
● Namics Technologies Inc.
● Zymet Inc.
● Sumitomo Bakelite Co. Ltd.
● Hitachi Chemical Company Ltd.
● Indium Corporation
● Master Bond Inc.
● KYOCERA Corporation
● Epoxy Technology Inc.
● Panasonic Corporation
● Nitto Denko Corporation
● Tanaka Chemical Corporation
● Mitsui Chemicals Inc.
● H.B. Fuller Company
● Dymax Corporation
Rapid expansion is expected in North America.
The North American market for moulded underfill materials is predicted to expand at the fastest rate worldwide, with the United States serving as the region’s undisputed leader. The existence of a number of important players in addition to the increasing demand for innovative packaging solutions in the electronics industry has contributed significantly to the market’s expansion.
Increasing demand for miniaturisation of electronic equipment, along with expanding investments in the semiconductor industry, may be the driving force behind Europe’s rapid expansion. The ever-evolving regional automotive electronics sector, which increasingly employs ICs and PCBs, may potentially contribute to the region’s growth.
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